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有兴趣的朋友请将中英文简历发到 staffing.asia@sandisk.com or staffing_asia@sandisk.com
Education Requirements/Preference:
• University Graduate in Mechanical and Electronic Engineering or equivalent Technical Degree.
Years Experience:
• Minimum 5 or more years of related experience in Storage product (HDD/SSD) manufacturing process and quality control.
• Must strong knowledge of product (HDD/SSD) qualification process and related reliability test and FA methodology.
• Profound knowledge in PCB and PCBA manufacturing field.
• Experience in Quality Assurance System and Process Control methodology.
• Strong knowledge of ISO 9000/14000/18000.
• Good knowledge in statistical tools and software such as SPC, DOE, Taguchi, FMEA and Microsoft suite.
• Six Sigma Green Belt or ASQ certified quality engineer certification is required.
• Knowledge of worldwide environmental regulations, like RoHS, WEEE, Reach.
• Must demonstrate the ability to work well with people, internally and externally.
• Must possess strong problem solving technique and able to work under stress in a fast paced and dynamic environment
• Able to multi-task and meet deadline effectively. Directly manage outgoing material quality from single source Suppliers.
Tasks to be performed & areas of responsibility
• Change review and approval. Manage and control all changes to manufacturing and test processes through qualification of change and documentation.
• Be responsible for the accurate documentation of all manufacturing and test processes at subcontractor location.
• Participate in Qualification process of new Supplier and new part numbers. Lead and coordinate Qualification process of new part numbers for Suppliers in ASL.
• Manage on-going reliability management (ORM) of products manufactured at subcontractor location.
• Conduct Subcontractor/supplier Quality Scorecard & Assessment Program to product/material quality.
• Work closely with various Manufacturing Subcontractors in Southern China to sustain high volume production of multiple product lines.
• Work closely with Card Packaging Assembly Development Engineers in Asia, Europe and US for the transition of new products and new processes from Qualification Phase to Mass Production phase. Responsible for yield and process sustaining activity after new product ramp-up phase.
• Perform periodical assembly process audit at Manufacturing Subcontractors/Suppliers and drive the CA & PA closure.
• Monitor SanDisk product manufacturing yields at Manufacturing Subcontractors/Suppliers and drive the CIP.
• Environmental test report and MDDS report review and approval. |
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